SAN FRANCISCO, United States – Teledyne Judson Technologies, a subsidiary of Teledyne Technologies Incorporated (NYSE: TDY) and a global leader in advanced imaging solutions, has announced the launch of the SCION Family of short-wave infrared (SWIR) cameras, a new high-performance camera line designed for high-volume and demanding scientific and industrial applications.
Unveiled in early 2026, the SCION platform introduces a new class of SWIR imaging solutions featuring a 10-micron pixel pitch and sensor formats of 640 × 512 and 1,280 × 1,024 pixels. The cameras combine Teledyne’s long-standing expertise in high-sensitivity sensor manufacturing with the speed, flexibility, and cost efficiency required in markets such as hyperspectral imaging, biosciences, space and defense, and semiconductor inspection.
The SCION camera family supports a broad range of applications, including material analysis, fluorescence measurement, defect detection, and Earth observation. Initial sensor configurations provide spectral sensitivity from 300 to 1,700 nanometers (nm) and 900 to 2,500 nm, utilizing Teledyne’s proprietary VisGaAs (visible-sensitive indium gallium arsenide) and MCT (mercury cadmium telluride) sensor technologies.
Designed for both performance and precision, SCION cameras deliver wide spectral sensitivity alongside high frame rates and advanced sample-up-the-ramp (SUPR) readout capability. This combination enables sub-one-electron read noise with a one-second acquisition time, supporting applications that demand exceptional image clarity and measurement accuracy.
“SCION reflects our ability to unite sensor manufacturing and camera system expertise within Teledyne to support evolving imaging applications,” said Paul Mark, Director of Infrared and Spectroscopy at Teledyne Judson Technologies. “By combining VisGaAs sensitivity with low-noise, thermoelectrically cooled camera design and advanced readout modes, the SCION VIS–SWIR camera delivers a flexible platform for applications where performance, stability, and integration efficiency are critical.”
Beyond technical performance, the SCION platform is engineered to simplify system integration and reduce overall costs. By unifying the sensor, vacuum package, and camera electronics within a single architecture, Teledyne minimizes supply-chain complexity, reduces supplier dependencies, and lowers technical and schedule risks. The system is custom-designed from the pixel level through the application programming interface (API) and software development kits (SDKs), reinforcing Teledyne’s “Pixel-to-PC” design philosophy.
Teledyne plans to showcase the SCION camera family at several major industry events throughout 2026, including SPIE Photonics West from January 20 to 22 in San Francisco, California (Booth 427), and the SPIE Defense + Commercial Sensing Conference from April 28 to 30 in National Harbor, Maryland (Booth 703). Live demonstrations will highlight the platform’s performance and architectural flexibility.
The launch of SCION underscores Teledyne’s broader strategy to deliver reliable, scalable imaging solutions while supporting emerging commercial and scientific markets worldwide.
Source : globenewswire.com
